Ohmite Manufacturing - DA-T263-301E-TR

HEAT SINK;

SK681000SA by Fischer Elektronik & Kg is a heat sink with a thermal resistance of 5.85 ohm. It has a screw profile, measuring 33mm in height and 46mm in width. This extruded heat sink, with a length of 1000mm, is commonly used on transistors for effective heat dissipation.

HEAT SINK; Body Material: ALUMINUM; Finish: ANODIZED; Thermal Resistance: 8.9 ohm; Color: BLACK; Height: 19 mm;

HEAT SINK;

HEAT SINK;

HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: U; Fin Orientation: TRANSVERSE; Length: 35.05 mm;

FK24408D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x8x10mm and weighing 2.2g. Primarily used on ICs, it efficiently dissipates heat to prevent overheating in electronic devices. Ideal for bulk packaging applications due to its compact size and lightweight design.

Boyd's 531102B00000G Heat Sink has a Thermal Resistance of 10.4 ohm, Height of 38.1mm, and Length of 34.92mm. Ideal for cooling electronic components in compact spaces with its extruded aluminum construction and radial fin orientation.

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Height: 40 mm; Finish: ANODIZED; Color: BLACK;

HEAT SINK; Profile: U; Body Material: COPPER; Construction: FIN; Fin Orientation: LONGITUDINAL; Packing Method: TAPE AND REEL;

HEAT SINK; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Thermal Resistance: 3.5 ohm; Length: 100 mm;

HEAT SINK; Body Material: COPPER; Device Used On: TRANSISTOR; Length: 25.91 mm; Finish: TIN; Thermal Resistance: 15 ohm;

HEAT SINK;

HEAT SINK;

HEAT SINK;

ICKBGA35X35 by Fischer Elektronik & Kg is a 6mm tall, black anodized heat sink with fin construction. It measures 35mm in width and length, designed for IC devices to dissipate heat efficiently. Ideal for electronic applications requiring compact cooling solutions.

Boyd 576802B03100G Heat Sink has Thermal Resistance of 27.3 ohm, Height 12.7mm, and Width 14.48mm. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.

HEAT SINK;

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: IC; Fin Orientation: RADIAL; Approvals (V): UL;

HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 13 mm; Length: 19.5 mm; Finish: ANODIZED;