Boyd - 61085

HEAT SINK;

HEAT SINK; Body Material: COPPER; Height: 10.16 mm; Finish: TIN; Length: 22.86 mm; Thermal Resistance: 15 ohm;

Boyd's 574602B03300G heat sink has a thermal resistance of 21.6 ohm, U profile, and aluminum body material. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or LED lighting systems.

HEAT SINK; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Thermal Resistance: 3.5 ohm; Length: 100 mm;

FK24413D3PAK by Fischer Elektronik & Kg is a 10mm tall, 31mm wide, and 13mm long heat sink made of copper. Weighing 3.9g with a TIN LEAD finish, it is designed for use on ICs to dissipate heat efficiently in electronic devices.

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM ALLOY; Fin Orientation: LONGITUDINAL; Width: 12.7 mm; Length: 45 mm; Height: 38.1 mm;

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 19.05 mm;

HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Height: 10 mm;

HEAT SINK;

HEAT SINK;

HEAT SINK; Body Material: COPPER; Finish: TIN; Packing Method: TAPE AND REEL; Height: 9.52 mm; Thermal Resistance: 15 ohm;

HEAT SINK;

HEAT SINK; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Width: 19.4 mm; Thermal Resistance: 7.8 ohm;

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Length: 13.21 mm;

FK24413DPAK by Fischer Elektronik & Kg is a 10x13x23 mm copper heat sink weighing 3.3g, designed for ICs. It efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability in various applications.

Wakefield Thermal Solutions' 908-35-2-23-2-B-0 heat sink features a thermal resistance of 10.03 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device is 35mm wide, 12mm high, and used on ICs for effective heat dissipation in various electronic applications.

Heat Sinks;

HEAT SINK;

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: IC; Fin Orientation: RADIAL; Power (Rated): 15 W;