Ohmite Manufacturing - 518-95AB

HEAT SINK; Construction: EXTRUDED; Height: 31.8 mm; Length: 38.1 mm; Weight: 68.04 g; Width: 120.7 mm;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Color: BLACK; Finish: ANODIZED; Length: 61 mm;

Heat Sinks;

The TDK 7G0011A heat sink has a thermal resistance of 8.24Ω, with dimensions of 5.7mm x 37.4mm x 50mm and weight of 14.6g. It is designed for converters, featuring an omnidirectional fin orientation for efficient heat dissipation in various applications.

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 27.3 ohm;

HEAT SINK; Device Used On: IC; Construction: FIN; Width: 23 mm; Length: 23 mm; Finish: BLACK ANODIZED;

HEAT SINK; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Width: 19.4 mm; Thermal Resistance: 7.8 ohm;

374424B00035G by Boyd is a PIN FIN ARRAY heat sink with dimensions of 27mm x 27mm x 18mm. It features anodized black aluminum construction and omnidirectional fin orientation. This heat sink is ideal for applications requiring efficient thermal management in electronic devices.

HEAT SINK; Height: 4.8 mm; Color: BLACK; Length: 10 mm; Finish: ANODIZED; Width: 19 mm;

HEAT SINK;

258 by Wakefield Thermal Solutions is a black anodized aluminum heat sink with U profile, measuring 12.7mm x 6.4mm x 8.6mm and weighing 0.82g. Ideal for cooling electronic components in compact devices due to its small size and lightweight design.

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Finish: ANODIZED; Height: 24.1 mm; Width: 57.9 mm;

Boyd's 577102B04000G Heat Sink has a thermal resistance of 25.9 ohm, U profile, and transverse fin orientation. Ideal for cooling electronic components in compact spaces due to its dimensions (13.21mm x 9.52mm x 19.05mm) and anodized black finish.

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM ALLOY; Construction: EXTRUDED; Height: 50 mm; Color: BLACK;

HEAT SINK; Body Material: ALUMINUM; Length: 19.1 mm; Color: BLACK; Finish: ANODIZED; Width: 13.2 mm;

Boyd's 7109DG/TR heat sink has a thermal resistance of 11 ohm, made of copper with dimensions 25.4mm x 19.38mm x 11.43mm. Ideal for ICs due to folded-back fin orientation and TIN finish, packaged in tape and reel for easy handling during assembly.

HEAT SINK; Body Material: CHROMATE; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Width: 59 mm; Additional Features: MAXIFLOW, DEVICE USED ON: HALF BRICK DC-DC CONVERTER;

TE Connectivity's 1963856-1 is a HEAT SINK with dimensions of 111.5x85.6x10.27mm, made of ALUMINUM ALLOY with ANODIZED finish. Its FIN construction and LONGITUDINAL orientation make it ideal for thermal management in various electronic applications.

HEAT SINK; Profile: U; Body Material: COPPER; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 19.7 ohm;

HEAT SINK;