Boyd - 374424B00035G

Boyd 530613B00000G Heat Sink has Thermal Resistance of 16.7 ohm, U Profile, and Aluminum Body Material. Ideal for cooling electronic components in compact spaces with its dimensions of 25.4mm x 12.7mm x 29.97mm.

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Length: 50.8 mm; Color: BLACK; Finish: ANODIZED;

FK24413D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10mm and weighing 3.6g. Primarily used on ICs, it efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability.

HEAT SINK; Height: 31.75 mm; Finish: ANODIZED; Length: 45.97 mm; Thermal Resistance: 5.4 ohm; Width: 45.97 mm;

HEAT SINK; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Finish: ANODIZED; Height: 19.05 mm;

HEAT SINK; Body Material: ALUMINUM; Fin Orientation: OMNIDIRECT; Height: 12.7 mm; Width: 46 mm; Length: 46 mm;

FK224MI2201 by Fischer Elektronik & Kg is an aluminum HEAT SINK with 18 ohm Thermal Resistance. Measuring 8.3mm in height, 25mm in width, and 29.4mm in length, it is designed for TRANSISTOR applications.

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Width: 13.46 mm; Height: 4.83 mm;

SK481000SA by Fischer Elektronik & Kg is a 1000mm long, 20mm high black anodized heat sink with thermal resistance of 3.5 ohm. It is used on transistors for effective heat dissipation due to its extruded construction and longitudinal fin orientation.

HEAT SINK;

HEAT SINK;

Boyd 531002B00000G Heat Sink features Thermal Resistance of 13.4 ohm, Height 25.4mm, and Length 34.9mm. Ideal for cooling electronic components in compact spaces due to its extruded aluminum construction and radial fin orientation.

HEAT SINK; Body Material: ALUMINUM; Height: 9.5 mm; Length: 19 mm; Width: 13.5 mm;

374424B00035G by Boyd is a PIN FIN ARRAY heat sink with dimensions of 27mm x 27mm x 18mm. It features anodized black aluminum construction and omnidirectional fin orientation. This heat sink is ideal for applications requiring efficient thermal management in electronic devices.

The Ohmite RA-T2X-51E heat sink, made of aluminum, measures 42x25x50.8 mm and weighs 51g. With an anodized black finish and omnidirectional fin orientation, it efficiently dissipates heat in various electronic applications.

HEAT SINK;

HEAT SINK; Profile: U; Body Material: COPPER; Construction: CLIP; Fin Orientation: TRANSVERSE; Finish: TIN;

HEAT SINK; Device Used On: CONVERTER; Construction: FIN PIN; Fin Orientation: OMNIDIRECT; Width: 61 mm; Weight: 158 g;

Boyd's 581002B02500G Heat Sink has a Thermal Resistance of 17.4 ohm, Height of 25.4mm, and is made of Aluminum. Ideal for ICs, this anodized black heat sink with longitudinal fin orientation efficiently dissipates heat in electronic devices.

ICKS36X36X20 by Fischer Elektronik & Kg is a heat sink with a thermal resistance of 3.2 ohm. It has a profile of adhesive and dimensions of 36.4mm x 36.4mm x 20mm, making it suitable for various applications in thermal management.