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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | TZA3019BVH |
| Description | ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 32; Package Code: HVBCC; Package Shape: SQUARE; |
| Datasheet | TZA3019BVH Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Telecom IC Type: | ATM/SONET/SDH SUPPORT CIRCUIT |
| Applications: | SDH; SONET |
| Maximum Seated Height: | .8 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 32 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 5 mm |
| JESD-30 Code: | S-PBCC-B32 |
| Package Shape: | SQUARE |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVBCC |
| Width: | 5 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
