Microchip Technology - ZL30121GGG2V2

ZL30121GGG2V2 by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number ZL30121GGG2V2
Description ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;
Datasheet ZL30121GGG2V2 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.72 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 100
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B100
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Width: 9 mm
Moisture Sensitivity Level (MSL): 3
Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA100,10X10,32
Length: 9 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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