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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | SA638 |
| Description | RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR; |
| Datasheet | SA638 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3 V |
| Maximum Seated Height: | 1.2 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| No. of Terminals: | 24 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | BICMOS |
| JESD-30 Code: | R-PDSO-G24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TSSOP |
| Width: | 4.4 mm |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP24,.25 |
| Length: | 7.8 mm |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3 |
