Texas Instruments - SN74AS871DW

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE; Qualification: Not Qualified;

Other Memory ICs;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;

MEMORY CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

Other Memory ICs;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Words Code: 16M;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;

EPCQ64ASI16N by Intel is a 8MX8 NOR type memory IC with 67108864 bit memory density. It operates in synchronous mode at up to 100 MHz clock frequency, suitable for industrial applications. With a small outline package style and 3-state output characteristics, it offers reliable performance in a compact form factor.

MEMORY CIRCUIT; No. of Terminals: 149; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 512MX16; No. of Words Code: 512M;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: ZIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

EPCQ32ASI8N by Intel is a 4MX8 NOR type memory IC with 3-STATE output, operating at up to 100 MHz clock frequency. It has a memory density of 33554432 bits and operates in industrial temperature grade applications. With a small outline package style and synchronous operation, it is suitable for various embedded systems requiring high-speed non-volatile memory solutions.

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Package Equivalence Code: LCC20,.35SQ;

CRYPTO MEMORY; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE; Organization: 128KX1;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Terminal Finish: TIN LEAD; Minimum Operating Temperature: 0 Cel; Qualification: Not Qualified;