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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | PEF22554HT |
| Description | FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 160; Package Code: LBGA; Package Shape: SQUARE; |
| Datasheet | PEF22554HT Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Carrier Type-2: | T-1(DS1) |
| Carrier Type-1: | CEPT PCM-30/E-1 |
| Maximum Seated Height: | 1.6 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 160 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE |
| JESD-30 Code: | S-PBGA-B160 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LBGA |
| Width: | 15 mm |
| Telecom IC Type: | FRAMER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | QFP144,.87SQ,20 |
| Length: | 15 mm |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.8,3.3 |
