Dallas Semiconductor - DS2502P-E48/TR

MEMORY CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: VLGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 8192 bit;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-J20;

FM33256B-GTR by Infineon Technologies is a 32KX8 EEPROM+FLASH memory IC with CMOS technology. Operating in synchronous mode, it has a memory density of 262144 bit and supports an organization of 32768 words. This small outline package is ideal for industrial applications requiring a temperature range from -40 to 85 °C.

Other Memory ICs; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 16;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B88;

47L16T-I/ST by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is ideal for industrial applications requiring a memory density of 16384 bit, fast access time of 400 ns, and operating temperature range from -40 to 85°C.

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 64; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 16;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;

Other Memory ICs;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Organization: 128KX8; Terminal Finish: TIN LEAD;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Shape: ROUND; Maximum Access Time: 15000 ns; Organization: 4KX1;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1024 words;