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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | TFRA08C13-DB |
| Description | FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 352; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | TFRA08C13-DB Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.54 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 352 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B352 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Width: | 35 mm |
| Telecom IC Type: | FRAMER |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 35 mm |
| Peak Reflow Temperature (C): | 225 |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
