Boyd - 7106D/TRG

Boyd 529802B02500G Heat Sink has Thermal Resistance of 3.7 ohm, Height 38.1mm, and Length 41.91mm. Ideal for cooling electronic components in compact spaces with radial fin orientation and anodized black finish.

HEAT SINK; Body Material: ALUMINUM; Width: 13.2 mm; Length: 19.1 mm; Height: 9.5 mm; Color: BLACK;

Ohmite's WA-T247-101E heat sink has thermal resistance of 11Ω, height 30.5mm, and length 23.1mm. Ideal for transistors, this extruded aluminum alloy clip-on heat sink with longitudinal fin orientation is anodized black and weighs 12g.

TE Connectivity's 1963856-1 is a HEAT SINK with dimensions of 111.5x85.6x10.27mm, made of ALUMINUM ALLOY with ANODIZED finish. Its FIN construction and LONGITUDINAL orientation make it ideal for thermal management in various electronic applications.

HEAT SINK; Body Material: ALUMINUM; Fin Orientation: OMNIDIRECT; Width: 25 mm; Color: BLACK; Weight: 38 g;

HEAT SINK; Body Material: ALUMINUM ALLOY; Fin Orientation: LONGITUDINAL; Width: 12.7 mm; Length: 45 mm; Height: 38.1 mm;

HEAT SINK;

HEAT SINK;

DA-T263-101E-TR by Ohmite Manufacturing is a heat sink with dimensions of 10.16mm x 12.7mm x 25.91mm and a weight of 3.8g. It is made of anodized aluminum and is used on transistors for thermal management purposes.

HEAT SINK; Construction: EXTRUDED; Color: BLACK; Height: 78.6 mm; Width: 80 mm; Finish: ANODIZED;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Length: 50.8 mm; Color: BLACK; Finish: ANODIZED;

HEAT SINK;

FK24413D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10mm and weighing 3.6g. Primarily used on ICs, it efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability.

FK24413DPAKTR by Fischer Elektronik & Kg is a 10x13x23mm copper heat sink weighing 3.3g, suitable for ICs. It comes in tape and reel packaging, ideal for thermal management applications due to its compact size and efficient heat dissipation capabilities.

HEAT SINK; Body Material: COPPER; Device Used On: IC; Fin Orientation: FOLDEDBACK; Thermal Resistance: 11 ohm; Width: 19.38 mm;

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Length: 34.5 mm;

Boyd 530613B00000G Heat Sink has Thermal Resistance of 16.7 ohm, U Profile, and Aluminum Body Material. Ideal for cooling electronic components in compact spaces with its dimensions of 25.4mm x 12.7mm x 29.97mm.

HEAT SINK; Construction: EXTRUDED; Height: 31.8 mm; Length: 38.1 mm; Weight: 68.04 g; Width: 120.7 mm;

HEAT SINK; Device Used On: IC; Construction: FIN; Width: 14 mm; Length: 14 mm; Height: 6 mm;