Fischer Elektronik & Kg - SK89100SA

HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 12.7 mm; Width: 14.48 mm; Finish: ANODIZED;

The Ohmite RA-T2X-51E heat sink, made of aluminum, measures 42x25x50.8 mm and weighs 51g. With an anodized black finish and omnidirectional fin orientation, it efficiently dissipates heat in various electronic applications.

Boyd's PF750G Heat Sink features a Thermal Resistance of 20.3 ohm, Copper Body Material, and U Profile. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or industrial equipment.

Boyd 576802B03100G Heat Sink has Thermal Resistance of 27.3 ohm, Height 12.7mm, and Width 14.48mm. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.

HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Weight: 6.7 g; Color: BLACK;

HEAT SINK;

HEAT SINK; Profile: U; Body Material: COPPER; Construction: FIN; Fin Orientation: LONGITUDINAL; Packing Method: TAPE AND REEL;

FK237SA220H by Fischer Elektronik & Kg is a black anodized aluminum heat sink with dimensions 19.05mm x 14.5mm x 12.7mm (LxWxH). Designed for transistors, it efficiently dissipates heat in electronic devices, ensuring optimal performance and longevity.

ICKS36X36X20 by Fischer Elektronik & Kg is a heat sink with a thermal resistance of 3.2 ohm. It has a profile of adhesive and dimensions of 36.4mm x 36.4mm x 20mm, making it suitable for various applications in thermal management.

HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Thermal Resistance: 5.85 ohm;

Boyd 7106DG Heat Sink has Thermal Resistance of 15 ohm, Height 9.52mm, and Width 14.99mm. Ideal for TRANSISTOR applications due to COPPER body material and TIN finish ensuring efficient heat dissipation in compact spaces.

HEAT SINK; Device Used On: IC; Construction: FIN; Length: 40 mm; Finish: BLACK ANODIZED; Height: 10 mm;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Finish: ANODIZED; Height: 24.1 mm; Width: 57.9 mm;

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Color: BLACK; Width: 57.9 mm; Height: 24.1 mm;

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Fin Orientation: TRANSVERSE; Width: 13 mm;

HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 15 mm; Length: 59 mm;

Boyd's 552844B00000G Heat Sink has a Thermal Resistance of 8.7 ohm, Height of 18.29mm, and Width of 45.2mm. Ideal for cooling electronic components in various applications due to its anodized finish and aluminum construction.

HEAT SINK; Body Material: COPPER; Fin Orientation: LONGITUDINAL; Width: 14.99 mm; Thermal Resistance: 15 ohm; Length: 25.91 mm;

Boyd 531002B00000G Heat Sink features Thermal Resistance of 13.4 ohm, Height 25.4mm, and Length 34.9mm. Ideal for cooling electronic components in compact spaces due to its extruded aluminum construction and radial fin orientation.