Telecom - Switching ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
GSW125-AQM-T	Maxlinear	ETHERNET SWITCH
LAN9312-NZW	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	295 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	HQFP128,.63SQ,16	Network Interfaces	.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm	Not Qualified	e3			14 mm
LAN9353T/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm		e3			10 mm
LAN9355I/ML	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.5SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N88		1 mm	12 mm			NOT SPECIFIED	NOT SPECIFIED	12 mm
IDT72V70210DAG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified	e3			20 mm
KSZ8565RTXV-TRVAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm			30	260	14 mm
VSC7425XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm					27 mm
ZL50011/QCC	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	160	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			250 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP160,1.0SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G160		1.6 mm	24 mm	Not Qualified	e0			24 mm
VSC7423XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm					27 mm
VSC7514XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm					17 mm
MT90869AG2	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		200 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B272	3	2.32 mm	27 mm	Not Qualified	e1			27 mm
ZL50020QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			120 mA	1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G256		1.6 mm	28 mm	Not Qualified	e3			28 mm
IDT72V70190PFG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	14 mm	Not Qualified	e3	40	260	14 mm
ZL50022QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			175 mA	1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G256		1.6 mm	28 mm	Not Qualified	e3			28 mm
ZL50023QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			130 mA	1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G256		1.6 mm	28 mm					28 mm
72V70200PFG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.01 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e3	30	260	14 mm
IDT72V70200PFG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e3			14 mm
IDT72V70190PFG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	14 mm	Not Qualified	e3			14 mm
IDT72V71660BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e1			17 mm
LAN9355/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.5SQ,20		.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N88		1 mm	12 mm			NOT SPECIFIED	NOT SPECIFIED	12 mm
LAN9355/PT	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm			NOT SPECIFIED	NOT SPECIFIED	12 mm
KSZ8893FQL	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified	e3			20 mm
KSZ8893FQL-FX	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified	e3			20 mm
LAN9353TI/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm		e3			10 mm
MT90812AL1	Microsemi	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		15 mA	5 V	5	FLATPACK	QFP64,.7X.95,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G64		3.4 mm	14 mm	Not Qualified	e3			20 mm
VSC7440XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3300 mA	1 V		GRID ARRAY	BGA324,18X18,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.8 mm	19 mm					19 mm
72V70190PFG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	14 mm	Not Qualified	e3	30	260	14 mm
72V70800PFG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	14 mm	Not Qualified	e3	30	260	14 mm
IDT72V70800PFG8	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	14 mm	Not Qualified	e3	40	260	14 mm
IDT72V73263BB	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e0	30	225	17 mm
KSZ8775CLXCC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	SPQFP80,.48SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm		e3			10 mm
VSC7422XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm					27 mm
ARWSC-XRS7003E	Tttech Flexibilis Oy	ETHERNET SWITCH		NO LEAD	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20		.5 mm	100 Cel	-40 Cel		QUAD	S-PQFP-G144		1.65 mm	20 mm					20 mm
M34116C1	STMicroelectronics	CONFERENCING CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		50 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified	e0			11.505 mm
SJA1105REL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm					12 mm
SJA1105SEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm					12 mm
VSC7424XJG-02	Microchip Technology	ETHERNET SWITCH		BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm					27 mm
VSC7428XJG-12	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm					27 mm
VSC7448YIH-02	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			7600 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm					27 mm
72V71660BBG8	Renesas Electronics	DIGITAL TIME SWITCH																				TIN SILVER COPPER			3				e1		260
72V73273BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.38 mA	3.3 V	3.3	GRID ARRAY	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e1	30	260	17 mm
72V90823PQFG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.045 mA	3.3 V	3.3	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G100	3	3.4 mm	14 mm	Not Qualified	e3		260	20 mm
C9300L-24P-4X-A	Cisco Systems	ETHERNET SWITCH								1
GSW141A3MC	Maxlinear	ETHERNET SWITCH
KSZ8993	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			330 mA	2.5 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified	e3			20 mm
LAN9311I-NZW	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	295 mA	3.3 V	3.3/3.6	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	Network Interfaces	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm	Not Qualified	e3			14 mm
ZL50012QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	160	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			250 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP160,1.0SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G160		1.6 mm	24 mm	Not Qualified	e3			24 mm
72V73263BBG	Renesas Electronics	DIGITAL TIME SWITCH	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm	17 mm	Not Qualified	e1		260	17 mm

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.