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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | VSC7425XJG-02 |
| Description | ETHERNET SWITCH; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 672; Package Code: HBGA; Package Shape: SQUARE; |
| Datasheet | VSC7425XJG-02 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1 V |
| Telecom IC Type: | ETHERNET SWITCH |
| Maximum Seated Height: | 2.44 mm |
| Surface Mount: | YES |
| Maximum Supply Current: | 2700 mA |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 672 |
| Package Equivalence Code: | BGA672,26X26,40 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 27 mm |
| JESD-30 Code: | S-PBGA-B672 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | HBGA |
| Width: | 27 mm |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | OTHER |
