RF/Microwave Splitter/Combiners

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum Input Power (CW)	Maximum Voltage Standing Wave Ratio	Maximum Supply Current	Construction	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Minimum Isolation	Maximum Insertion Loss	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
ADA4304-4ACPZ-R7	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	54 MHz	865 MHz
ZAPD-2-S+	Mini-circuits	SPLITTER AND COMBINER	PANEL MOUNT				40 dBm	1.26	800 mA	COAXIAL			50 ohm		100 Cel	-55 Cel		19 dB	.6 dB	SMA		1000 MHz	2000 MHz
ZAPD-2-S	Mini-circuits	COMBINER					40 dBm	1.26		COAXIAL			50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)		.6 dB	SMA, ISOLATION-MIN (DB):19	e0	1000 MHz	2000 MHz
ZB4PD1-500-S	Mini-circuits	COMBINER					30 dBm	1.14		COAXIAL			50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)		1.5 dB	SMA	e0	5 MHz	500 MHz
ZB4PD1-500-S+	Mini-circuits	COMBINER					30 dBm	1.14		COAXIAL			50 ohm		100 Cel	-55 Cel			1.5 dB	SMA		5 MHz	500 MHz
EP2-28+	Mini-circuits	SPLITTER AND COMBINER	SURFACE MOUNT	6	PLASTIC/EPOXY	GAAS	27.99 dBm	1.3		COMPONENT		SOLCC6(UNSPEC)	50 ohm		105 Cel	-55 Cel		17 dB	2.3 dB			25000 MHz	35000 MHz
PD2635L5050S2HF	Ttm Technologies	SPLITTER															Gold (Au) - with Nickel (Ni) barrier				e4
SP-2G1+	Mini-circuits	COMBINER					31.76 dBm	1.5		COMPONENT			50 ohm		85 Cel	-40 Cel			1.3 dB	ISOLATION-MIN (DB):20		1200 MHz	2000 MHz
ZFSC-2-1-N+	Mini-circuits	SPLITTER AND COMBINER	PANEL MOUNT				30 dBm	1.14		COAXIAL			50 ohm		100 Cel	-55 Cel		20 dB	.8 dB	N		5 MHz	500 MHz
ZFSC-2-1-N	Mini-circuits	SPLITTER AND COMBINER	PANEL MOUNT				30 dBm	1.14		COAXIAL			50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	20 dB	.8 dB	N	e0	5 MHz	500 MHz
6014-3	Cobham Plc	SPLITTER					30 dBm	1.2		COAXIAL			50 ohm		125 Cel	-65 Cel				SMA, I/P POWER-MAX(PEAK)=1000W		0 MHz	6000 MHz
EP2W1+	Mini-circuits	SPLITTER AND COMBINER					33.98 dBm	1.7		COMPONENT			50 ohm		85 Cel	-40 Cel			4.5 dB	ISOLATION-MIN (DB):6.3		500 MHz	9500 MHz
GP2X1+	Mini-circuits	COMBINER	SURFACE MOUNT	12	PLASTIC/EPOXY		31.76 dBm	1.3		COMPONENT		LCC12,.12SQ,20	50 ohm		85 Cel	-40 Cel		10 dB	1.9 dB	ISOLATION-MIN (DB):10		2800 MHz	7200 MHz
JEPS-12-10+	Mini-circuits	COMBINER					26.99 dBm	1.12		COMPONENT			50 ohm		85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier		4 dB	ISOLATION-MIN (DB):14	e3	50 MHz	1000 MHz
PB-5	Pulsar Microwave	SPLITTER
PD0810J5050S2HF	Ttm Technologies	SPLITTER					33.01 dBm			COMPONENT			50 ohm		85 Cel	-55 Cel	NICKEL GOLD		.6 dB		e4	800 MHz	1000 MHz
QCN-19	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC, METAL-SEALED COFIRED		41.76 dBm	1.2		COMPONENT		SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	19 dB	.9 dB	ISOLATION-MIN (DB):19	e0	1100 MHz	1925 MHz
QCN-19+	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC		41.76 dBm	1.2		COMPONENT		SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier	19 dB	.9 dB	ISOLATION-MIN (DB):19	e3	1100 MHz	1925 MHz
QCN-19D	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC	HYBRID	41.76 dBm	1.21		COMPONENT		SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)	19 dB	.9 dB	ISOLATION-MIN (DB):19	e0	1100 MHz	1925 MHz
QCN-19D+	Mini-circuits	COMBINER	SURFACE MOUNT	6	CERAMIC	HYBRID	41.76 dBm	1.21		COMPONENT		SOLCC6,.06,40	50 ohm		100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier	19 dB	.9 dB	ISOLATION-MIN (DB):19	e3	1100 MHz	1925 MHz
SBTC-2-10-75LX+	Mini-circuits	SPLITTER AND COMBINER					26.99 dBm	1.35		MODULE			75 ohm		85 Cel	-40 Cel			1.4 dB	ISOLATION-MIN (DB):17		10 MHz	1000 MHz
SEPS-8-153+	Mini-circuits
ZFSC-2-372-S+	Mini-circuits	SPLITTER AND COMBINER					44.77 dBm	1.99		COAXIAL			50 ohm		85 Cel	-40 Cel			1.6 dB	SMA		10 MHz	3700 MHz
JPS-2-1	Mini-circuits	COMBINER					30 dBm	1.3		COMPONENT			50 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		.9 dB	ISOLATION-MIN (DB):20	e0	1 MHz	500 MHz
JPS-2-1+	Mini-circuits	COMBINER					30 dBm	1.3		COMPONENT			50 ohm		85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier		.9 dB	ISOLATION-MIN (DB):20	e3	1 MHz	500 MHz
JPS-2-1-75	Mini-circuits	COMBINER					30 dBm	1.19		COMPONENT			75 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		.7 dB	ISOLATION-MIN (DB):18	e0	5 MHz	500 MHz
JPS-2-1-75+	Mini-circuits	COMBINER					30 dBm	1.19		COMPONENT			75 ohm		85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier		.7 dB	ISOLATION-MIN (DB):18	e3	5 MHz	500 MHz
JPS-2-1N+	Mini-circuits	SPLITTER AND COMBINER					30 dBm	1.22		COMPONENT			50 ohm		85 Cel	-40 Cel	Tin (Sn) - with Nickel (Ni) barrier		.5 dB	ISOLATION-MIN (DB):20	e3	350 MHz	550 MHz
JPS-2-1W+	Mini-circuits	SPLITTER AND COMBINER					30 dBm	1.1		COMPONENT			50 ohm		85 Cel	-40 Cel	TIN OVER NICKEL		1.4 dB	ISOLATION-MIN (DB):16	e3	3 MHz	750 MHz
PD4859L5050S2HF	Ttm Technologies	SPLITTER															Gold (Au) - with Nickel (Ni) barrier				e4
SCN-2-35	Mini-circuits	COMBINER					36.02 dBm			COMPONENT			50 ohm		100 Cel	-55 Cel	Tin/Lead (Sn/Pb)		1.3 dB	ISOLATION-MIN (DB):13	e0	2825 MHz	3700 MHz
SCN-2-35+	Mini-circuits	COMBINER					36.02 dBm			COMPONENT			50 ohm		100 Cel	-55 Cel	Tin (Sn) - with Nickel (Ni) barrier		1.3 dB	ISOLATION-MIN (DB):13	e3	2825 MHz	3700 MHz
SCP-4-4	Mini-circuits	COMBINER					30 dBm	1.61		COMPONENT			50 ohm		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		1.5 dB	ISOLATION-MIN (DB):17	e0	800 MHz	1000 MHz
TCP-2-25X+	Mini-circuits	SPLITTER AND COMBINER					26.99 dBm	2.27		MODULE			50 ohm		85 Cel	-40 Cel			1.3 dB	ISOLATION-MIN (DB):10		200 MHz	2500 MHz
X3DC23P1S	Ttm Technologies	COMBINER
LRPS-2-11	Mini-circuits	COMBINER					30 dBm	1.98		COMPONENT			50 ohm		85 Cel	-40 Cel	TIN LEAD		1.5 dB	ISOLATION-MIN (DB):15	e0	20 MHz	2000 MHz
LRPS-2-11+	Mini-circuits	COMBINER					30 dBm	1.98		COMPONENT			50 ohm		85 Cel	-40 Cel	MATTE TIN OVER NICKEL		1.5 dB	ISOLATION-MIN (DB):15	e3	20 MHz	2000 MHz
PD16-73LF	Skyworks Solutions	SPLITTER					31.76 dBm	1.4		COMPONENT					85 Cel	-40 Cel	Matte Tin (Sn)		.6 dB		e3	1420 MHz	1660 MHz
SDL-3	Synergy Microwave	SPLITTER					44.77 dBm			COMPONENT			50 ohm		85 Cel	-40 Cel			1.5 dB	ISOLATION-MIN (DB):17		10 MHz	1000 MHz
ADA4304-2ACPZ-R2	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz
ADA4302-4ACP-RL7	Analog Devices	SPLITTER	SURFACE MOUNT	20	PLASTIC/EPOXY				240 mA		5	LCC20,.16SQ,20		RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)				e0
ADA4303-2ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	12	PLASTIC/EPOXY				90 mA	COMPONENT	5	LCC12,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	0 MHz	1700 MHz
ADA4302-4ACPZ-RL1	Analog Devices	SPLITTER
ADA4304-4ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz
ADA4304-2ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	54 MHz	865 MHz
HMC-C006	Analog Devices	SPLITTER					41.14 dBm			COAXIAL			50 ohm		85 Cel	-55 Cel	Gold (Au) - with Nickel (Ni) barrier			SMA-F	e4	500 MHz	18000 MHz
ADA4303-2ACPZ-R7	Analog Devices	SPLITTER	SURFACE MOUNT	12	PLASTIC/EPOXY				90 mA	COMPONENT	5	LCC12,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	MATTE TIN				e3	0 MHz	1700 MHz
ADA4304-3ACPZ-RL	Analog Devices	SPLITTER	SURFACE MOUNT	16	PLASTIC/EPOXY				105 mA	COMPONENT	5	LCC16,.12SQ,20	75 ohm	RF/Microwave Splitter/Combiners	85 Cel	-40 Cel	Matte Tin (Sn)				e3	54 MHz	865 MHz

RF/Microwave splitter/combiners are electronic devices used to divide or combine high frequency signals in radio frequency (RF) and microwave applications. They are commonly used in RF and microwave communication systems, antennas, and radar systems.

A splitter is a device that takes a single input signal and divides it into multiple output signals. A combiner, on the other hand, takes multiple input signals and combines them into a single output signal. Splitter/combiners can be designed to split or combine signals evenly or with specific power ratios, depending on the application.

Splitter/combiners can be made with a variety of technologies, including microstrip, stripline, and waveguide. Microstrip and stripline technologies are commonly used for lower frequency applications, while waveguide is used for higher frequency applications. Some splitter/combiners are also designed to operate over a wide bandwidth, allowing them to be used for multiple frequency bands.

Splitter/combiners are essential components in RF and microwave systems, allowing for efficient distribution of signals and combining of signals for transmission or reception. They are often used in conjunction with amplifiers, filters, and other RF and microwave components to achieve optimal system performance.