Xilinx - XCAU15P-1UBVA368I

Xilinx XC7A100T-L1FTG256I is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 130;

FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: RECTANGULAR;

Xilinx XC7A100T-2CSG324I FPGA offers 101440 logic cells, 7925 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

Xilinx XC6SLX45T-3FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 296 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, with a max operating temperature of 85°C. Ideal for projects demanding programmable ICs with advanced CMOS technology.

LFD2NX-40-8BG256I by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 39,000 logic cells and 9,750 CLBs. It uses FDSOI technology and has a max supply voltage of 1.05V. This FPGA is suitable for industrial applications requiring high-performance programmable ICs.

Xilinx XC7A35T-2FTG256I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE; Qualification: Not Qualified;

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

MPF300T-1FCG784E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w 0-100°C, and uses plastic/epoxy package for surface mount applications.

LCMXO2-4000HC-4TG144C by Lattice Semiconductor is a FPGA with 4320 logic cells, 114 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-speed data processing in compact electronic devices.

XC7A200T-2FB676I by Xilinx is a FPGA with 16825 CLBs, 1.05V max supply voltage, and 1.05ns combinatorial delay. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 27mm square package with 676 terminals.

EP3C10F256C8N by Intel is a FPGA with 10320 logic cells, 182 inputs/outputs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;

EP3C25F324I7N by Altera is a 1.2V CMOS FPGA with 24,624 logic cells, 215 inputs/outputs, and a maximum clock frequency of 472.5MHz. It is a versatile programmable IC suitable for industrial applications.

Intel's 10M16SCE144I7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C and low profile package style.