Xilinx - XC7Z035-1FFG900C

XC7Z035-1FFG900C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7Z035-1FFG900C
Description PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.35 mm;
Datasheet XC7Z035-1FFG900C Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: PROGRAMMABLE SYSTEM ON CHIP
Nominal Supply Voltage: 1 V
Maximum Supply Voltage: 1.05 V
Maximum Seated Height: 3.35 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 900
Package Equivalence Code: BGA900,30X30,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 31 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 31 mm
Terminal Pitch: 1 mm
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