![XC7K325T-L2FFG900I by Xilinx XC7K325T-L2FFG900I by Xilinx](https://partstack.com/mpn/images/200/8046517710.webp)
Image shown is a representation only.
Manufacturer | Xilinx |
---|---|
Manufacturer's Part Number | XC7K325T-L2FFG900I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .97 V; |
Datasheet | XC7K325T-L2FFG900I Datasheet |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .93 V |
Package Body Material: | PLASTIC/EPOXY |
Organization: | 25475 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Combinatorial Delay of a CLB: | .61 ns |
Maximum Seated Height: | 3.35 mm |
Surface Mount: | YES |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 900 |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | S-PBGA-B900 |
Package Shape: | SQUARE |
Package Code: | BGA |
Width: | 31 mm |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Maximum Supply Voltage: | .97 V |
Nominal Supply Voltage (V): | .95 |
No. of CLBs: | 25475 |
JESD-609 Code: | e1 |
Finishing Of Terminal Used: | TIN SILVER COPPER |
Length: | 31 mm |
Form Of Terminal: | BALL |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 245 |