Xilinx - XC7K325T-L2FFG900I

XC7K325T-L2FFG900I by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XC7K325T-L2FFG900I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .97 V;
Datasheet XC7K325T-L2FFG900I Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .93 V
Package Body Material: PLASTIC/EPOXY
Organization: 25475 CLBS
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Combinatorial Delay of a CLB: .61 ns
Maximum Seated Height: 3.35 mm
Surface Mount: YES
Position Of Terminal: BOTTOM
No. of Terminals: 900
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: .97 V
Nominal Supply Voltage (V): .95
No. of CLBs: 25475
JESD-609 Code: e1
Finishing Of Terminal Used: TIN SILVER COPPER
Length: 31 mm
Form Of Terminal: BALL
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products