Xilinx - XC7A50T-3CPG236E

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XC7A50T-3CPG236E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7A50T-3CPG236E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XC7A50T-3CPG236E Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Organization: 4075 CLBS
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Combinatorial Delay of a CLB: .94 ns
Maximum Seated Height: 1.38 mm
No. of Inputs: 250
Sub-Category: Field Programmable Gate Arrays
Surface Mount: YES
No. of Outputs: 250
Position Of Terminal: BOTTOM
No. of Terminals: 236
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
JESD-30 Code: S-PBGA-B236
Maximum Clock Frequency: 1412 MHz
Package Shape: SQUARE
Maximum Operating Temperature: 100 Cel
Package Code: LFBGA
Width: 10 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: OTHER
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
No. of Logic Cells: 52160
No. of CLBs: 4075
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA236,19X19,20
Finishing Of Terminal Used: TIN SILVER COPPER
Length: 10 mm
Form Of Terminal: BALL
Pitch Of Terminal: .5 mm
Peak Reflow Temperature (C): 260
Power Supplies (V): 1
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