Winbond Electronics - W632GU6NB12I

W632GU6NB12I by Winbond Electronics

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Manufacturer Winbond Electronics
Manufacturer's Part Number W632GU6NB12I
Description DDR3L DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 96; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
Datasheet W632GU6NB12I Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 128MX16
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.283 V
Surface Mount: YES
No. of Terminals: 96
No. of Words: 134217728 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B96
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 95 Cel
Package Code: VFBGA
Width: 7.5 mm
No. of Ports: 1
Memory Density: 2147483648 bit
Memory IC Type: DDR3L DRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Length: 13 mm
No. of Words Code: 128M
Nominal Supply Voltage / Vsup (V): 1.35
Additional Features: AUTO/SELF REFRESH
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.45 V
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