Western Digital - SDSDQAF3-064G-I

SDSDQAF3-008G-I by Western Digital is an 8GX8 flash memory chip with MLC NAND technology. It operates in ASYNCHRONOUS mode, has a memory density of 68719476736 bits, and can withstand temperatures from -25 to 85°C. Ideal for applications requiring high-speed data storage in compact devices.

Micron Technology's MT29F1G08ABADAWP-IT:DTR is a 128MX8 SLC NAND flash memory with 1073741824-bit density. Operating at 3.3V, it has an industrial temperature grade and supports parallel mode. With a compact form factor of 18.4mm x 12mm x 1.2mm, it is ideal for high-performance embedded applications requiring reliable non-volatile storage.

Macronix's MX25L51245GZ2I-08G is a 128MX4 flash memory IC with 536870912-bit memory density. Operating at 166 MHz, it has a supply voltage range of 2.7V to 3.6V and industrial temperature grade. This small-outline package with dual terminals is ideal for synchronous applications requiring high-speed data storage.

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; No. of Functions: 1;

MX25V8035FM1I by Macronix is a 8Mb Flash Memory with synchronous operation and a clock frequency of up to 108MHz. It has a small outline package style, making it suitable for industrial applications requiring high memory density and reliable performance.

S25FL256SAGNFI003 by Infineon is a 64MX4 NOR flash memory with 268MB density. It operates at 3V, has SPI serial interface, and supports up to 133MHz clock frequency. Ideal for industrial applications requiring high endurance with 100k write/erase cycles.

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Current: 100 mA;

SST25VF016B-75-4I-S2AF by Microchip: 16MX1 NOR Flash Memory with 80MHz clock, SPI serial bus. Ideal for industrial applications, offers 100k write/erase cycles and operates at -40 to 85°C. Package style: small outline, terminal finish: nickel palladium gold.

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;

Micron Technology's MT29F2G16ABAEAWP:ETR is a 3.3V SLC NAND flash memory with 128Mx16 organization and 2147483648-bit memory density. Operating in asynchronous mode, it has a temperature range of 0-70°C and is suitable for commercial applications requiring high-speed parallel memory access.

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;

FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Alternate Memory Width: 1;

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;

Kioxia Holdings' THGBMJG6C1LBAIL is an 8GX8 flash memory IC with 68719476736-bit memory density. It operates b/w -25°C to 85°C, with a voltage range of 2.7V to 3.6V. This rectangular GRID ARRAY package is surface-mountable and ideal for applications requiring high-speed data storage in compact devices.