Texas Instruments - XAM3359ZCZ

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

AM3505AZCN by Texas Instruments is a microprocessor with 16-bit address bus width and 8-bit on-chip data RAM. It operates at a max clock frequency of 26 MHz, suitable for low power applications. With integrated cache and boundary scan feature, it is ideal for embedded systems requiring high-speed processing in compact form factors.

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

MCIMX535DVP2C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words and 27 MHz clock frequency. It features a CMOS technology, 529 terminals, and operates b/w -20 to 85 °C. Ideal for applications requiring high-speed processing in compact devices.

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage: 2.5 V;

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

NXP Semiconductors' MCF5251CVM140 microprocessor features 32-bit architecture, 140 MHz clock frequency, and 24-bit address bus width. Ideal for industrial applications requiring high-speed processing in a compact square package with ball terminals.

The Texas Instruments AM5728BABCX microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 38.4 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and automotive electronics.

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;