Texas Instruments - TMS27PC49-4TL

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 256KX16;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 30; Package Shape: RECTANGULAR; No. of Words: 24576 words; Technology: CMOS;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G32;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 16;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: PSRAM IS ORGANISED AS 8M X 16BIT;

Analog Devices' DS2401P+T&R is a 64-bit MEMORY CIRCUIT with 6 terminals, operating at 5V. It features ASYNCHRONOUS mode, CMOS technology, and industrial temperature grade. The IC is used in applications requiring small outline packages for memory storage in devices like sensors or IoT modules.

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; Package Style (Meter): SPECIAL SHAPE; Memory Density: 384 bit;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B88;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Width: 8 mm;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Other Memory ICs;

CY15B108QN-20LPXCES by Infineon Technologies is a 1MX8 MEMORY CIRCUIT with 8388608 bit Memory Density. It operates at 3.3V, has a small outline package style, and synchronous operating mode. Ideal for applications requiring high memory capacity in commercial temperature environments.

ST25DV04K-IER6T3 by STMicroelectronics is a 4Kx1 memory IC with 4096-bit memory density. It operates synchronously at 3.3V, suitable for industrial applications. The small outline package has a rectangular shape, 0.65mm terminal pitch, and dual terminal position for surface mount assembly.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;

Other Memory ICs;