Texas Instruments - TMS27C32-100NE4

Other Memory ICs;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;

Other Memory ICs;

Other Memory ICs;

AT88SC0104CA-SH by Microchip Technology is a CRYPTO MEMORY IC with 1024 bit memory density. It operates at 3/3.3V, has an organization of 128X8, and a max access time of 250ns. This small outline package is ideal for secure applications requiring synchronous operation in industrial temperature environments.

MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-609 Code: e3; JESD-30 Code: X-XXSS-X; Terminal Form: UNSPECIFIED; Technology: CMOS;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 16;

Other Memory ICs; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP16,.3;

MEMORY CIRCUIT; No. of Terminals: 149; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Width: 16; No. of Words: 268435456 words;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;

47L16-E/ST by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is ideal for automotive applications due to its thin profile, wide temperature range (-40 to 125°C), and high memory density of 16384 bits.

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP16,.3;

M24SR64-YMN6T/2 by STMicroelectronics is a MEMORY CIRCUIT IC with 65536 bit memory density. It operates at 3.3V, has 8KX8 organization, and supports synchronous mode. Ideal for industrial applications requiring small outline package style and dual terminal position.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 1;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Package Body Material: METAL; No. of Functions: 1;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Organization: 1MX16;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 1;

Other Memory ICs;