Texas Instruments - TMS27C291-45N

AT88SC0204C-MJ by Microchip Technology is a 2048-bit CRYPTO MEMORY IC with 256x8 organization. It operates synchronously, has a max access time of 35ns, and supports a supply voltage range from 2.7V to 5.5V. This surface-mount chip is ideal for secure memory applications in commercial-grade environments.

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 16;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 105 Cel;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;

DS2401 by Maxim Integrated is a 64-bit memory circuit with CMOS technology. It operates asynchronously at 5V, with a supply voltage range of 2.8-6V. This through-hole IC in cylindrical package shape is ideal for industrial applications requiring reliable memory storage and identification capabilities.

MR2A16ACMA35 by Everspin: 256KX16 memory IC with 35ns access time, operates at 3.3V. Suitable for industrial applications, features low profile grid array package and CMOS technology.

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.3 V;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; Terminal Form: UNSPECIFIED; No. of Words Code: 256;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Organization: 1MX16;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: VLGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;

MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFP; Package Shape: SQUARE; JESD-30 Code: S-CQFP-G68;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;