Texas Instruments - DRA829VMTGBALFR

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DRA829VMTGBALFR by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number DRA829VMTGBALFR
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 827; Package Code: FBGA; Package Shape: SQUARE; RAM Words: 3670016;
Datasheet DRA829VMTGBALFR Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .76 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .8 V
Integrated Cache: YES
Maximum Seated Height: 2.8 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
On Chip Data RAM Width: 8
No. of Terminals: 827
No. of Serial I/Os: 31
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 0
Technology: CMOS
RAM Words: 3670016
JESD-30 Code: S-PBGA-B827
Maximum Clock Frequency: 27 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: FBGA
Width: 24 mm
Moisture Sensitivity Level (MSL): 3
Speed: 2000 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: .84 V
No. of External Interrupts: 1
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 64
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA827,29X29,32
Length: 24 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .8 mm
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