Texas Instruments - DM505MRABF

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 1313; Package Code: FBGA; Package Shape: SQUARE;

Multifunction Peripherals; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: WQCCJ; Package Shape: SQUARE;

LS1017AXE7PQA by NXP Semiconductors is a Multi-functional Peripheral IC with 32-bit External Data Bus, 262144 RAM Words, and 448 Terminals. It operates in Industrial Temperature Grade range (-40 to 105 °C) and supports I2C, SAI, SPI, UART bus compatibility. Ideal for applications requiring high-performance peripherals in compact form factors.

Multifunction Peripherals; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: LFBGA; Package Shape: SQUARE;

Multifunction Peripherals; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE;

SYSTEM ON CHIP; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

CY8C27243-24PVXIT by Infineon is a multi-functional peripheral IC with 256 RAM words, operating at a max frequency of 24.6 MHz. It has 16 I/O lines and supports I2C and USB bus compatibility. This CMOS technology chip is ideal for applications requiring small outline packages and low power consumption.

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: SSOP; Package Shape: RECTANGULAR;

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE;

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

Multifunction Peripherals; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 784; Package Code: LFBGA; Package Shape: SQUARE;

Multifunction Peripherals; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 538; Package Code: LFBGA; Package Shape: SQUARE;

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL;

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL;

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSOP; Package Shape: RECTANGULAR;

The NXP Semiconductors MIMX8MM2CVTKZAA is a multi-functional SoC with 288K RAM, suitable for industrial applications. It features a max supply voltage of 1V, operating temperature range from -40 to 105°C, and compatibility with Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB interfaces. This package has a grid array style with 486 terminals in a square shape.