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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | DLPR100DWC |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | DLPR100DWC Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 2MX8 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | OTP ROMs |
| Surface Mount: | YES |
| No. of Terminals: | 8 |
| No. of Words: | 2097152 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| JESD-30 Code: | R-PDSO-G8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | SOP |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 16777216 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOP8,.25 |
| No. of Words Code: | 2M |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 2.5/3.3 |
