Texas Instruments - CD40105BH

BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Organization: 64X36;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; No. of Functions: 1;

OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Width: 11.43 mm;

OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL PALLADIUM GOLD;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .002 Amp;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;

BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 262144 words;

BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Cycle Time: 20 ns;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 5.5 V;

OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

SN74V263PZAEP by Texas Instruments is a FIFO memory with 8Kx18 organization, operating at 133 MHz. It features a cycle time of 7.5 ns and synchronous operation, suitable for military-grade applications requiring fast data processing and low power consumption. With a package style of flatpack and low profile design, it offers high memory density of 147456 bits in a compact form factor.

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Surface Mount: YES;

BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Terminal Position: QUAD;

OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;

BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Technology: CMOS;

OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 18432 bit;