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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | BQ2022DBZR |
| Description | OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; |
| Datasheet | BQ2022DBZR Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 1KX1 |
| Output Characteristics: | OPEN-DRAIN |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.12 mm |
| Minimum Supply Voltage (Vsup): | 2.65 V |
| Sub-Category: | OTP ROMs |
| Surface Mount: | YES |
| Maximum Supply Current: | .02 mA |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| No. of Terminals: | 3 |
| Maximum Clock Frequency (fCLK): | .01667 MHz |
| No. of Words: | 1024 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G3 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TSSOP |
| Width: | 1.3 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Input/Output Type: | COMMON |
| Memory Density: | 1024 bit |
| Memory IC Type: | OTP ROM |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TO-236 |
| Length: | 2.92 mm |
| No. of Words Code: | 1K |
| Nominal Supply Voltage / Vsup (V): | 2.7 |
| Additional Features: | ORGANIZED AS 4 PAGES OF 32 BYTES EACH |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | .95 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 5.5 V |
| Power Supplies (V): | 3/5 |
