Texas Instruments - AM5716AABCXEQ1

AM5716AABCXEQ1 by Texas Instruments

Image shown is a representation only.

Manufacturer Texas Instruments
Manufacturer's Part Number AM5716AABCXEQ1
Description SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;
Datasheet AM5716AABCXEQ1 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.11 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.15 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.96 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 760
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B760
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.2 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA760,28X28,31
Length: 23 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products