Texas Instruments - AM1802EZWTD3

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: HBGA; Package Shape: SQUARE;

Intel AV8063801116903SR0T5 is a 64-bit microprocessor with integrated cache, CMOS technology, and speed of 3200 rpm. It features a grid array package style with 1023 terminals for surface mount applications. Ideal for high-performance computing and server applications.

NXP Semiconductors' MPC860DEVR80D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. It is designed for low power mode applications, utilizing a 3.3V nominal voltage and integrated cache for enhanced performance in embedded systems.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 257; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;

The NXP Semiconductors MPC8270CZUQLDA microprocessor features a 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 83.33 MHz. It is commonly used in applications requiring high-speed processing and integrated cache memory for improved performance.

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;

Microprocessors;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: FBGA; Package Shape: SQUARE;

P1014NXE5HFB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 100 MHz. This processor features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices. With a package style of grid array and fine pitch, this chip offers advanced performance in a small form factor.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 609; Package Code: LFBGA; Package Shape: SQUARE; Bit Size: 32;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.07 mm;

AM3352BZCZA100 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and fixed point format processing. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 320; Package Code: TFBGA; Package Shape: SQUARE; On Chip Data RAM Width: 8;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;

The NXP Semiconductors MCF5329CVM240 microprocessor features a 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. With a temperature range of -40 to 85°C, it is suitable for various embedded systems.