STMicroelectronics - STM32MP153DAB1

MICROPROCESSOR;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

AM3359BZCZA80 by Texas Instruments is a 32-bit microprocessor with 8-bit RAM width and 28-bit address bus. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array with a terminal pitch of 0.8 mm, making it ideal for compact designs in harsh environments.

AM3358BZCZ100 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and a max clock frequency of 26 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

MCIMX6QP6AVT1AB by NXP Semiconductors is a microprocessor with a max supply voltage of 1.5V and operating temperature range of -40 to 125°C. It is commonly used in automotive applications due to its CMOS technology and fine pitch grid array package style.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: TFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1.27 mm;

ATSAMA5D27C-LD1G-CU by Microchip features 16-bit architecture, 24 MHz clock frequency, and 32KB RAM. Ideal for industrial applications requiring low power consumption and high-speed processing.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;