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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | M2316HB1 |
| Description | MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; |
| Datasheet | M2316HB1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 2KX8 |
| Sub-Category: | MASK ROMs |
| Surface Mount: | NO |
| Maximum Supply Current: | 70 mA |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 24 |
| No. of Words: | 2048 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | MOS |
| JESD-30 Code: | R-PDIP-T24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Memory Density: | 16384 bit |
| Memory IC Type: | MASK ROM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP24,.6 |
| Maximum Access Time: | 300 ns |
| No. of Words Code: | 2K |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | COMMERCIAL |
