![BGM11S22F256GA-V2 by Silicon Labs BGM11S22F256GA-V2 by Silicon Labs](https://partstack.com/mpn/images/200/8271763414.webp)
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Manufacturer | Silicon Labs |
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Manufacturer's Part Number | BGM11S22F256GA-V2 |
Description | TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Terminal Finish: NICKEL GOLD; |
Datasheet | BGM11S22F256GA-V2 Datasheet |
NAME | DESCRIPTION |
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Maximum Time At Peak Reflow Temperature (s): | 40 |
Telecom IC Type: | TELECOM CIRCUIT |
Peak Reflow Temperature (C): | 260 |
Terminal Finish: | NICKEL GOLD |
JESD-609 Code: | e4 |
Moisture Sensitivity Level (MSL): | 3 |