Renesas Electronics - ICS1660M

  1. Home
  2. Renesas Electronics - ICS1660M
ICS1660M by Renesas Electronics

Image shown is a representation only.

Manufacturer Renesas Electronics
Manufacturer's Part Number ICS1660M
Description TELEPHONE CALLING NO IDENTIFICATION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet ICS1660M Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Telecom IC Type: TELEPHONE CALLING NO IDENTIFICATION CIRCUIT
Surface Mount: YES
Terminal Finish: TIN LEAD
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
No. of Terminals: 20
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Technology: CMOS
JESD-30 Code: R-PDSO-G20
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Package Code: SOP
Temperature Grade: COMMERCIAL
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

TA31065FA by Toshiba

TA31065FA

Toshiba

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
PCD3311CPN by NXP Semiconductors

PCD3311CPN

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
TEA1096N by NXP Semiconductors

TEA1096N

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
LT1684IN#PBF by Linear Technology

LT1684IN#PBF

Linear Technology

TELEPHONE RINGER CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
KA2412A by Samsung

KA2412A

Samsung

TELEPHONE SPEECH CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T14;
TEA1069H-T by NXP Semiconductors

TEA1069H-T

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
S1T8501X01-D0B0 by Samsung

S1T8501X01-D0B0

Samsung

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
935263380512 by NXP Semiconductors

935263380512

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
PCD3310PN by NXP Semiconductors

PCD3310PN

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
PCD3312CT by Philips Semiconductors

PCD3312CT

Philips Semiconductors

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
KS58527E by Samsung

KS58527E

Samsung

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR;
TA31065FA-TP2 by Toshiba

TA31065FA-TP2

Toshiba

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
EFG7189PD by STMicroelectronics

EFG7189PD

STMicroelectronics

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
LT1684CS by Analog Devices

LT1684CS

Analog Devices

TELEPHONE RINGER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
TEA1062AT by NXP Semiconductors

TEA1062AT

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TEA1095TD-T by NXP Semiconductors

TEA1095TD-T

NXP Semiconductors

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
TEA1095PN by NXP Semiconductors

TEA1095PN

NXP Semiconductors

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
TA31001F-TP1 by Toshiba

TA31001F-TP1

Toshiba

TELEPHONE RINGER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LS1240D1 by STMicroelectronics

LS1240D1

STMicroelectronics

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
TEA1067T-T by NXP Semiconductors

TEA1067T-T

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;