Plx Technology - PEX8606-BA50BCG

SoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;

PSoC;

Other uPs/uCs/Peripheral ICs; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVQCCN; Package Shape: RECTANGULAR; Package Equivalence Code: SOLCC8,.08,20;

The Xilinx XC7Z015-1CL485I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a square grid array package, it's ideal for various applications requiring low profile and fine pitch components.

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

The Xilinx XC7Z015-2CLG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 485 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities in compact designs.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Technology: CMOS;

NETWORK CONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HQCCN; Package Shape: SQUARE;

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 441; Package Code: FBGA; Package Shape: SQUARE; Length: 17.2 mm;

XCZU4EV-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

ESP32-S3-WROOM-1-N8R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage of 3-3.6 V. Ideal for IoT applications due to its compact MICROELECTRONIC ASSEMBLY package style and surface mount capability.

FT245RQ-TRAY by FTDI is a 32-terminal chip carrier with a square package shape. It operates b/w -40 to 85 °C, suitable for industrial use. With a terminal pitch of 0.5 mm, it is ideal for microprocessor circuits requiring supply voltage b/w 3.3 V to 5.25 V.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

MCIMX6Q6AVT10AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.35V to 1.5V. Ideal for automotive applications due to its fine pitch grid array package style and 624 terminals in a square shape.