Onsemi - KLI-2104-DAA-EB-AE

IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 45.34 inch; Maximum Supply Voltage: 15.5 V; Master Clock: 40 MHz;

IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: 29-35mA; Minimum Supply Voltage: 1.7 V;

IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 3364; Minimum Supply Voltage: 14.5 V; Dynamic Range: 66 dB;

Image Sensors;

IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40V; Horizontal Pixel: 750;

IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.36-1.44V; Termination Type: SOLDER;

IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Optical Format (inch): 4/3; Maximum Supply Voltage: 15.3 V;

IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Vertical Pixel: 800; Additional Features: GLOBAL SHUTTER;

IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.40-1.20V; Body Width: 9 inch;

IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -30 Cel; Sensitivity (V/lx.s): 5.3 V/lx.s;

IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Data Rate: 1 Mbps;

IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-1.50V; Body Height: 1.39 mm;

IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Pixel Size (um): 5.5X5.5; Body Width: 29.97 inch;

Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -10 Cel; Vertical Pixel: 658; Pixel Size (um): 7.4X7.4; Power Supplies (V): 22;

IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Maximum Operating Temperature: 70 Cel; Vertical Pixel: 1200;

Toshiba TCD1304AP is a CCD image sensor with 3648 horizontal pixels and 8x200 um pixel size. It operates b/w -25 to 60 °C, with output range of 1.50-3.50V. Ideal for applications requiring high sensitivity (160 V/lx.s) and a dynamic range of 50 dB in a ceramic, glass-sealed housing.

IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1000; Minimum Operating Temperature: -40 Cel; Array Type: FRAME;

IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -40 Cel; Dynamic Range: 60 dB;

IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33.02 mm; Pixel Size (um): 5.5X5.5; Vertical Pixel: 1200;

IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 512; Additional Features: IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON; Spectral Response (nm): 400-1000;