NXP Semiconductors - UCB1100LP/X3

UCB1100LP/X3 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number UCB1100LP/X3
Description MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet UCB1100LP/X3 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.6 mm
Sub-Category: Modems
Surface Mount: YES
Terminal Finish: TIN
No. of Terminals: 48
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
JESD-30 Code: S-PQFP-G48
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Package Code: LFQFP
Width: 7 mm
Telecom IC Type: MODEM-SUPPORT CIRCUIT
JESD-609 Code: e3
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: QFP48,.35SQ,20
Length: 7 mm
Terminal Pitch: .5 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 3.3
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