NXP Semiconductors - TEA5712PN

TEA5712PN by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA5712PN
Description AUDIO SINGLE CHIP RECEIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE, SHRINK PITCH;
Datasheet TEA5712PN Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Seated Height: 4.7 mm
Minimum Supply Voltage (Vsup): 2 V
Surface Mount: NO
Harmonic Distortion: .8 %
Terminal Finish: TIN/NICKEL PALLADIUM GOLD
JESD-609 Code: e3/e4
No. of Terminals: 32
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE, SHRINK PITCH
Length: 28.95 mm
JESD-30 Code: R-PDIP-T32
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Package Code: SDIP
General IC Type: AUDIO SINGLE CHIP RECEIVER
Demodulation Type: AM/FM
Nominal Signal to Noise Ratio (FM): 26 dB
Width: 10.16 mm
Terminal Pitch: 1.778 mm
Maximum Supply Voltage (Vsup): 12 V
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