NXP Semiconductors - TEA5592

TEA5592 by NXP Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TEA5592
Description	AUDIO SINGLE CHIP RECEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: SDIP; Package Shape: RECTANGULAR;
Datasheet	TEA5592 Datasheet

TEA5592 Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Seated Height:	4.7 mm
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	NO
Maximum Supply Current:	23 mA
No. of Terminals:	24
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE, SHRINK PITCH
JESD-30 Code:	R-PDIP-T24
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	85 Cel
Package Code:	SDIP
General IC Type:	AUDIO SINGLE CHIP RECEIVER
Width:	10.16 mm
Harmonic Distortion:	1.5 %
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Length:	21.85 mm
Nominal Output Voltage (AM):	55 mV
Demodulation Type:	AM/FM
Nominal Signal to Noise Ratio (FM):	30 dB
Nominal Output Voltage (FM):	110 mV
Terminal Pitch:	1.778 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	15 V

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