NXP Semiconductors - TEA1111AUH

  1. Home
  2. NXP Semiconductors - TEA1111AUH
TEA1111AUH by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1111AUH
Description TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: NO LEAD; No. of Terminals: 17; Package Code: DIE; Package Shape: RECTANGULAR;
Datasheet TEA1111AUH Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 3.3 V
Telecom IC Type: TELEPHONE SPEECH CIRCUIT
Surface Mount: YES
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
No. of Terminals: 17
Qualification: Not Qualified
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: BIPOLAR
JESD-30 Code: R-XUUC-N17
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 75 Cel
Package Code: DIE
Temperature Grade: COMMERCIAL EXTENDED
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

LS656AB by STMicroelectronics

LS656AB

STMicroelectronics

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TA31033F-TP2 by Toshiba

TA31033F-TP2

Toshiba

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TEA1064A/C2 by NXP Semiconductors

TEA1064A/C2

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
LS1240D1 by STMicroelectronics

LS1240D1

STMicroelectronics

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
KS58536 by Samsung

KS58536

Samsung

TELEPHONE DIALER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 5.08 mm;
LT1684CS#TRPBF by Linear Technology

LT1684CS#TRPBF

Linear Technology

Telephone Circuits; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP14,.25;
KA8505 by Samsung

KA8505

Samsung

TELEPHONE SPEECH CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
MK5370N00 by STMicroelectronics

MK5370N00

STMicroelectronics

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
PCD3311TD by NXP Semiconductors

PCD3311TD

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TA31065F(EL) by Toshiba

TA31065F(EL)

Toshiba

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
TEA7092TQT by STMicroelectronics

TEA7092TQT

STMicroelectronics

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
TA31053F(EL) by Toshiba

TA31053F(EL)

Toshiba

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
TEA1095TD by NXP Semiconductors

TEA1095TD

NXP Semiconductors

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
LT1684CS#TR by Analog Devices

LT1684CS#TR

Analog Devices

Telephone Circuits; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP14,.25;
PSB8510-1T by Infineon Technologies

PSB8510-1T

Infineon Technologies

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
L3924AN by STMicroelectronics

L3924AN

STMicroelectronics

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
TEA1114AT by NXP Semiconductors

TEA1114AT

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TCM1506BP-00 by Texas Instruments

TCM1506BP-00

Texas Instruments

TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
935262584518 by NXP Semiconductors

935262584518

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TA31002AF(ER) by Toshiba

TA31002AF(ER)

Toshiba

TELEPHONE RINGER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;