NXP Semiconductors - TEA1069AH-T

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TEA1069AH-T by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1069AH-T
Description TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
Datasheet TEA1069AH-T Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.7 V
Telecom IC Type: TELEPHONE MULTIFUNCTION CIRCUIT
Maximum Seated Height: 2.1 mm
Surface Mount: YES
Terminal Finish: TIN
JESD-609 Code: e3
Minimum Operating Temperature: -25 Cel
Make-break Ratio: 2:1
No. of Functions: 1
No. of Terminals: 44
Qualification: Not Qualified
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Length: 10 mm
JESD-30 Code: S-PQFP-G44
Package Shape: SQUARE
Terminal Form: GULL WING
Additional Features: 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT
Maximum Operating Temperature: 75 Cel
Package Code: QFP
Width: 10 mm
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL EXTENDED
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