NXP Semiconductors - TEA1067N

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TEA1067N by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1067N
Description TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet TEA1067N Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.8 V
Telecom IC Type: TELEPHONE SPEECH CIRCUIT
Maximum Seated Height: 4.7 mm
Surface Mount: NO
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
No. of Terminals: 18
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Length: 21.6 mm
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T18
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Additional Features: AVAILABLE ONLY IN NORTH AMERICA
Maximum Operating Temperature: 75 Cel
Package Code: DIP
Width: 7.62 mm
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL EXTENDED
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