NXP Semiconductors - TEA1064BT

TEA1064BT by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1064BT
Description TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet TEA1064BT Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.7 V
Maximum Seated Height: 2.65 mm
Sub-Category: Telephone Circuits
Surface Mount: YES
Maximum Supply Current: .0016 mA
No. of Terminals: 20
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Technology: BIPOLAR
JESD-30 Code: R-PDSO-G20
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 75 Cel
Package Code: SOP
Width: 7.5 mm
Telecom IC Type: TELEPHONE SPEECH CIRCUIT
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: SOP20,.4
Length: 12.8 mm
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL EXTENDED
Power Supplies (V): 2.7
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products