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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | TEA1060PN |
| Description | TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | TEA1060PN Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Telecom IC Type: | TELEPHONE SPEECH CIRCUIT |
| Maximum Seated Height: | 4.7 mm |
| Surface Mount: | NO |
| Minimum Operating Temperature: | -25 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 18 |
| Qualification: | Not Qualified |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| JESD-30 Code: | R-PDIP-T18 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Width: | 7.62 mm |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | OTHER |
