T1023NXE7MQA by NXP Semiconductors | Vyrian | Semiconductor & Electronic Component Distributor

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	T1023NXE7MQA
Description	MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;
Datasheet	T1023NXE7MQA Datasheet

NAME	DESCRIPTION
Minimum Supply Voltage:	.97 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1 V
Integrated Cache:	YES
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	2.07 mm
Surface Mount:	YES
Maximum Supply Current:	5 mA
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	525
No. of Serial I/Os:	5
Terminal Position:	BOTTOM
Format:	FIXED POINT
Package Style (Meter):	GRID ARRAY, FINE PITCH
No. of DMA Channels:	2
Address Bus Width:	16
Technology:	CMOS
JESD-30 Code:	S-PBGA-B525
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Package Code:	FBGA
Width:	19 mm
Moisture Sensitivity Level (MSL):	3
Speed:	1200 rpm
Peripheral IC Type:	MICROPROCESSOR
Maximum Supply Voltage:	1.03 V
No. of External Interrupts:	6
Low Power Mode:	YES
Boundary Scan:	YES
External Data Bus Width:	32
Bit Size:	64
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Package Equivalence Code:	BGA525,23X23,32
Length:	19 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL

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