NXP Semiconductors - SJA1105TELY

SJA1105TELY by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number SJA1105TELY
Description TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 159; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.5 mm;
Datasheet SJA1105TELY Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: 1.5 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 159
Package Equivalence Code: BGA159,14X14,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Data Rate: 100 Mbps
Screening Level: AEC-Q100
Length: 12 mm
JESD-30 Code: S-PBGA-B159
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Peak Reflow Temperature (C): 260
Package Code: LFBGA
Width: 12 mm
Terminal Pitch: .8 mm
Moisture Sensitivity Level (MSL): 3
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products