NXP Semiconductors - SA612AD/01,118

SA612AD/01,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SA612AD/01,118
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSSOP; Package Shape: RECTANGULAR;
Datasheet SA612AD/01,118 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.75 mm
Surface Mount: YES
Terminal Finish: NICKEL PALLADIUM GOLD SILVER
No. of Terminals: 8
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
JESD-30 Code: R-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LSSOP
Width: 3.9 mm
Moisture Sensitivity Level (MSL): 1
Telecom IC Type: TELECOM CIRCUIT
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Length: 4.9 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
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